Process Engineer "Interconnection Technology for Power Electronics"

At tno

The position

Would you like to be one of the pioneers to build and expand a new R&D center in the field of chip integration, engaging with leading industries in automotive, healthcare technology and other high-tech sectors?Then you are welcome at CITC in Nijmegen.


Your responsibilities

  • develop interconnect and assembly processes for a next generation of high power device;
  • participate with expertise and take responsibility in ongoing collaborative projects with international customers;
  • interact with our industrial partners and customers on a day-to-day basis.


Your profile

  • preferably with 3 to 7 years of experience in semiconductor industry in the field of package development or assembly engineering
  • hands-on knowledge of package reliability requirements, failure analysis techniques and quality systems;
  • excellent knowledge of assembly materials (die attach, passivation and encapsulation);
  • hands-on mentality, able to organize practical work in efficient and cooperative way;
  • BSc degree in mechanical engineering, electrical engineering or materials science;
  • knowledgeable with data handling, analysis and communication of results;
  • good communication skills in English.


For all inquiries, please contact:

Recruiter: Marcel Ernes
Mobile phone: +31 (0)6-153 51517


Apply now