The program’s goal is to develop novel patterning technologies, such as laser processing, optical lithography and embossing technologies, capable of manufacturing micron and sub-micron features on flexible substrates. Such technologies will be particularly useful in producing, for example, TFT driver circuits for displays, high-resolution patterns via laser printing, micro-fluidic channels for sensor arrays and light management structures for large-area electronic devices like OLED and thin-film photovoltaics.

Besides the actual patterning technologies, the program investigates the behavior of foils during processing. Here the aim is to measure and predict how a foil will deform, as well as to develop foil-on-carrier and carrier-less foil handling techniques to minimize deformation. In addition, the program works to integrate all the necessary technologies into complete multi-layer processes that will lay the foundation for future high-volume manufacturing lines.

With a broad range of expertise, the program team is a real melting pot of industry and academia. It includes partners from throughout the value chain including materials suppliers, process developers, equipment makers and consumer electronics companies as well as materials scientists, physicists and chemists. The team has already had success in developing demonstrators that are feeding into other programs, for example: